Specifications

Documentation

Specifications

FEATURES:

  • Lambertian Radiation Pattern
  • Anode-up design (p-pad up)
  • EZBright LED Technology, binned @ 350 mA
    • 450 nm – 540+ mW
    • 460 nm – 520+ mW
    • 470 nm – 480+ mW
    • 527 nm – 170+ mW
  • Low Forward Voltage (Vf): 3.1 V typical at 350 mA
  • Maximum DC Forward Current: 1500 mA
  • Backside Metal versions for various attach methods:
    • A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms
    • G (LTDA) for Low Temperature Flux Eutectic Attach

Documentation

Application Notes Version Last Updated

-

04 Aug 2017

Data Sheets Version Last Updated

G

14 Jul 2020

Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ1012 pbar, EZ1030, EZ1030 G4 AuSn, EZ1030 G4 AuSn 170um, EZ1050, EZ1050 G4 AuSn, EZ1614, EZ290 - 3uM Bond Pad, EZ290 - 6uM Bond Pad, EZ400, EZ500, EZ600, EZ700, EZ900, EZ950

02 Aug 2021

EZ LED Chips RoHS Declaration

EZ1000, EZ1012 pbar, EZ1030, EZ1030 G4 AuSn, EZ1030 G4 AuSn 170um, EZ1050, EZ1050 G4 AuSn, EZ1450, EZ1614, EZ1950, EZ2370, EZ290 - 3uM Bond Pad, EZ290 - 6uM Bond Pad, EZ400, EZ500, EZ500 G4, EZ600, EZ700, EZ700 G4, EZ900, EZ950

28 Dec 2020

Sales Terms Version Last Updated

A

01 Mar 2021

A

01 Mar 2021

A

01 Mar 2021

A

01 Mar 2021