Specifications

Documentation

Specifications

FEATURES:

  • EZBright LED technology, binned @ 350 mA
    • 450 nm: 240+ mW
    • 460 nm: 240+ mW
    • 470 nm: 240+ mW
    • 527 nm: 90+ mW
  • Lambertian radiation
  • Conductive epoxy, solder paste or preforms, or flux eutectic attach
  • Low forward voltage (Vf): 3.25 V typical at 350 mA
  • Single wire bond structure
  • Dielectric passivation across epi surface

Documentation

Application Notes Version Last Updated

-

04 Aug 2017

Data Sheets Version Last Updated

E

11 Jan 2019

Product Ecology Version Last Updated
EZ LED Chips REACh Declaration

EZ1000, EZ1012 pbar, EZ1030, EZ1030 G4 AuSn, EZ1030 G4 AuSn 170um, EZ1050, EZ1050 G4 AuSn, EZ1614, EZ290 - 3uM Bond Pad, EZ290 - 6uM Bond Pad, EZ400, EZ500, EZ600, EZ700, EZ900, EZ950

25 Jan 2021

EZ LED Chips RoHS Declaration

EZ1000, EZ1012 pbar, EZ1030, EZ1030 G4 AuSn, EZ1030 G4 AuSn 170um, EZ1050, EZ1050 G4 AuSn, EZ1450, EZ1614, EZ1950, EZ2370, EZ290 - 3uM Bond Pad, EZ290 - 6uM Bond Pad, EZ400, EZ500, EZ500 G4, EZ600, EZ700, EZ700 G4, EZ900, EZ950

28 Dec 2020

Sales Terms Version Last Updated

A

01 Mar 2021

A

01 Mar 2021

A

01 Mar 2021

A

01 Mar 2021